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AMD could add a Multimedia IO Die to the MI400, its fastest APU ever, and I have a theory as to what it could be

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  • AMD’s MI400 APU lands in 2026, boosting AI, HPC, and compute efficiency
  • New design features two AIDs with eight XCDs, doubling MI300’s density
  • Multimedia IO Die offloads IO tasks and may integrate Xilinx FPGA tech

AMD’s Instinct MI400 APU is set to arrive in 2026 – designed for AI, machine learning, and HPC workloads, the MI400 will build on Team Red’s chiplet-based modular architecture and is expected to increase compute density, power efficiency, and scalability.

It may also play a role in future supercomputing projects, including a possible successor to El Capitan, but so far, AMD has only confirmed that the MI400 will use the CDNA “Next” architecture.

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