Tech

Future exascale supercomputers will be built using these HPE Lego-like cabinets able to hold nearly 100,000 AMD EPYC Cores

Share
Share


  • HPE’s Cray EX4000 supports modular designs, scaling to 98,304 cores
  • Slingshot 400 interconnect doubles throughput, vital for exascale systems
  • AMD and Nvidia collaborations help compute density exceed 10 petaflops

Future exascale supercomputers will adopt modular designs that allow enhanced scalability and efficiency, new reports have claimed.

TheNextPlatform says Hewlett Packard Enterprise (HPE) is leading this transformation, with its Cray EX4000 systems, which use HPE’s Slingshot interconnect and innovative chassis to support up to 98,304 AMD Epyc cores per rack.

Share

Leave a comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Related Articles
AI took a huge leap in IQ, and now a quarter of Gen Z thinks AI is conscious
Tech

AI took a huge leap in IQ, and now a quarter of Gen Z thinks AI is conscious

ChatGPT’s o3 model scored a 136 on the Mensa IQ test and...

DeepSeek sees surge in developer use as 3 in 10 businesses adopt the controversial LLM provider
Tech

DeepSeek sees surge in developer use as 3 in 10 businesses adopt the controversial LLM provider

Developers shift from loyalty to flexibility as OpenAI leads, but DeepSeek gains...

China’s CATL launches new EV sodium battery
Tech

China’s CATL launches new EV sodium battery

Chinese battery giant CATL has launched a new sodium-ion battery it says...